Roadmap
Clicks:Updated:2016-11-15 10:11:12【Print】【Close】
YEAR
2011
2012
Materials
PTFE multilayer
M
M
YEAR |
2016 |
2017 |
Materials
|
PTFE multilayer
|
M
|
M
|
Halogen free
|
M(2supplier)
|
M
|
Hybrid Material
|
M
|
M
|
Metal-based
|
M
|
M
|
Heat sink PCB
|
M
|
M
|
PPO
|
M
|
M
|
Ceramic filler
|
M
|
M
|
Ceramic based
|
2 sides D
|
LTCC D
|
Max. layer
|
Layer counts
|
40P M
|
50D
|
Min line/Spce
|
Inner layer 3/3mil
|
3/3mil M
|
2/2mil P M
|
Board Thickness
|
Outer layer 4/3mil
|
4/3.5mil M
|
3/3mil P M
|
Board Thickness
|
330mil
|
400mil D
|
1000mil D
|
Min mechanical hole
|
8mil
|
6mil M
|
M
|
Max aspect ratio
|
16:1
|
18:1 M
|
M
|
Buried resistor
|
D
|
P
|
Buried capacitance
|
M
|
M(2supplier)
|
Controlled impedance
|
±10%
|
M
|
M
|
±5%
|
M
|
M
|
HDI
|
1+C+1
|
line card (M)
|
M
|
2+C+2
|
DS
|
P
|
Surface finishing
|
HASL; Im-gold; Gold finger; OSP
|
Im-Silver M
|
|
New product
|
|
Rigid-flex hybrid, Heavy copper(>6oz)
|
|
S =sample P = pilot run M = mass production D = under development
|
|