Materials

PTFE multilayer

M

M

Halogen free

M(2supplier)

M

Hybrid Material

M

M

Metal-based

M

M

Heat sink PCB

M

M

PPO

M

M

Ceramic filler

M

M

Ceramic based

2 sides D

LTCC D

Max. layer

Layer counts

40P M

50D

Min line/Spce

Inner layer 3/3mil

3/3mil M

2/2mil P M

Board Thickness

Outer layer 4/3mil

4/3.5mil M

3/3mil P M

Board Thickness

330mil

400mil D

1000mil D

Min mechanical hole

8mil

6mil M

M

Max aspect ratio

16:1

18:1 M

M

Buried resistor

D

P

Buried capacitance

M

M(2supplier)

Controlled impedance

±10%

M

M

±5%

M

M

HDI

1+C+1

line card (M)

M

2+C+2

DS

P

Surface finishing

HASL; Im-gold; Gold finger; OSP

Im-Silver M

New product

Rigid-flex hybrid, Heavy copper(>6oz)

S =sample P = pilot run M = mass production D = under development